Mühlbauer Die Sorting
Die Sorting Systems pick dies from a wafer and place them onto different carriers like carrier tape, waffle pack, jedec tray or film frame.
Mühlbauer can handle dies as small as 0.2 x 0.4 mm and down to 80 µm thickness with the highest level of precision and speed. A record speed of up to 30.000 UPH is reached thereby including a 100% vision inspection incl. SideWall Inspection. All of our vision technologies are developed in house to achieve high performance equipment solutions.